We refer to these processors as boxed processors. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Functionality, performance, and other benefits of this feature may vary depending on system configuration. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Add to Compare Shop for this product. CPU Cache is an area of fast memory located on the processor.
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Functionality, performance, and other benefits of this feature may vary depending on system configuration. CPU Cache is an area of fast memory located on the processor. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Find products with Pcu Options Available. Did you find the information on this site useful? Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply.
See your Intel representative for details. Support Home Product Specifications Processors.
Frequency is measured in gigahertz GHzor billion cycles per second. The socket is the component that provides the mechanical and electrical connections between the processor and motherboard. Idle States C-states are used to save power when the processor is idle. Cu processor base frequency is the operating point where TDP is defined. Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions.
Listing of RCP does not constitute a formal pricing offer from Intel. Listing ihtel these RCP does not constitute a formal pricing offer from Intel. This specific part is no longer being manufactured or purchased and no inventory is available.
Refer to Datasheet for thermal solution requirements. The information herein is provided “as-is” and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
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Intel Core i3 U vs Duo T
For benchmarking data see http: Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer nmindicative of the size of features built on the semiconductor.
What is inteel difference between Boxed and Tray Processors? Clear queue Compare 0. Core i7 Product Number: Your cpk and email address will not be added to any mailing list, and you will not receive email from Intel Corporation unless requested.
Please contact system vendor for more information on specific products or systems. A bus is a subsystem that transfers data between computer components or between computers.
Note that ECC memory support requires both processor and chipset support. Reference product technical documentation for full power specifications.
Linux PC (Genuine Intel(R) CPU T2300 @ 1.66GHz)
Please submit your comments, questions, or suggestions here. Highly threaded applications can get more work done in parallel, completing tasks sooner. Physical Address Extensions PAE is a feature that allows bit processors to access a physical address space larger than 4 gigabytes.
Thank you for your feedback. We refer to these processors as boxed processors. Intel processor numbers are not a measure of performance.
Please refer to the Launch Date for market availability. Intel refers to these processors as tray or OEM processors.